Tempco offers a complete range of brazed plate heat exchangers designed and developed specifically for the cooling needs of data centers, computing infrastructures in rapidly growing demand to meet the needs of new AI and HPC applications.
Among the cooling solutions offered by Tempco for data centers, particular attention is paid to the most innovative liquid cooling technologies, which offer greater efficiency in dissipating heat generated by chips – and therefore better temperature regulation – thanks to the superior thermal conductivity of liquids compared to traditional air cooling solutions. Tempco brazed plate exchangers therefore serve as a key technology for CDUs – Coolant Distribution Units – used in the liquid cooling of high-performance data centers, a strategic path to reduce the environmental impact of data centers, increase their sustainability and improve energy consumption efficiency (PUE, power usage effectiveness).
The improved thermal management made possible by liquid cooling also allows data centers to operate at higher power densities while maintaining high performance and reliability.

Liquid cooling for servers and electronic devices uses dielectric fluids, suitable for direct contact with chips and electronic equipment, in the case of direct immersion cooling, or for cold plates applications. Cold plates are special components used in the liquid cooling of electronic components, made of metals with high thermal conductivity (typically copper or aluminum). The chip or electronic component that overheats is attached directly to the cold plate, and the heat is transferred to it by conduction. Inside, the coolant flows through special microchannel structures, which greatly increase the contact surface with the overheated metal. The liquid then absorbs the heat and, via a small pump, is pushed out of the cold plate towards a heat exchanger or chiller.
In addition to the superior heat dissipation efficiency of the heat generated by servers, liquid cooling also offers another key advantage: compactness, allowing for the creation of high-density computing structures in data centers while saving installation space. The Tempco range of brazed exchangers for liquid cooling in data centers therefore offers very compact dimensions, which allow for easy integration into CDUs inside racks or in-row architectures, which can serve up to 10 racks.






















