High costs related to traditional data center conditioning systems can be eliminated thanks to free cooling solutions employed in immersion liquid cooling of IT equipments. This is a kind of applications that Tempco is strongly developing in collaboration with an important partner, with which we work since 10 years now, especially in the field of plate heat exchangers in the process industry sector.
Data centers are acknowledged for their high energy consumption, required in form of electrical capacity installed to feed the increasing demand of computing power, and also due to the high amount of heat generated by IT equipments. The heat generated is actually dissipated using classic conditioning solutions, using chillers and air/water thermal exchange batteries.
The new frontier being developed globally by such companies as Google, Amazon and Alibaba, that offers cloud data management services, is liquid cooling by direct immersion of electronic components of servers in dielectric fluids.
This innovative solution brings huge advantages, first of all in terms of temperature, that can be managed avoiding too many thermal steps. Electronic boards of servers can be indeed cooled down by direct immersion in dielectric fluids, avoiding the typical 3 temperature step required by air conditioning, freon/chilled water/cold air. This classic circuit requires indeed 3 steps, using chillers to cool down water, glicol water to cool down air and the cold air that finally cools down the electronic components.
Liquid cooling in data centers allows to dive the electronic boards in direct contact with the dielectric fluids. Leveraging on higher heat dissipation rate of fluids compared to air, liquid cooling also affords to work with less-low temperatures, allowing to employ free cooling systems to cool down dielectric fluids, avoiding the use of freon compressors and chillers, thus obtaining enormous energy savings.
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