{"id":11110,"date":"2026-02-13T12:35:31","date_gmt":"2026-02-13T11:35:31","guid":{"rendered":"https:\/\/www.tempco.it\/blog\/?p=11110"},"modified":"2026-02-13T15:41:15","modified_gmt":"2026-02-13T14:41:15","slug":"high-efficiency-exchangers-for-liquid-cooling-in-ai-hpc-data-centers","status":"publish","type":"post","link":"https:\/\/www.tempco.it\/blog\/en\/11110\/high-efficiency-exchangers-for-liquid-cooling-in-ai-hpc-data-centers\/","title":{"rendered":"High efficiency exchangers for liquid cooling in AI\/HPC data centers"},"content":{"rendered":"<p>The <strong>exponential global growth in computational capacity<\/strong> is driving the energy consumption of high-power chips. In AI and HPC (High Performance Computing) <strong>data centers<\/strong>, increasing power density is pushing air-cooled systems to their physical limits. On the other side, <strong><a href=\"https:\/\/www.tempco.it\/blog\/en\/8648\/immersion-liquid-cooling-in-data-center-and-hpc\/\">liquid cooling<\/a> technology<\/strong>, which until recently was marginal, is rapidly becoming a core infrastructure, offering the significant advantage of ensuring thermal efficiency hundreds of times greater than traditional air cooling.<\/p>\n<p>The <strong>AI\/HPC data centers sector<\/strong> is therefore accelerating its transition toward the use of <strong>large-scale liquid cooling technologies<\/strong>, driven by the achievement of sustainability targets and high power efficiency (PUE) values \u200b\u200bin new, large, high-performance data centers. To address this significant trend, <strong>Kaori<\/strong>, a Tempco partner in the field of heat transfer, recently <strong>introduced two new <a href=\"https:\/\/en.tempco.it\/solutions-en\/heat-exchangers\/\" target=\"_blank\" rel=\"noopener\">heat exchangers<\/a><\/strong> with highly attractive features specifically designed for new <strong>liquid cooling solutions in high-performance infrastructures<\/strong>.<\/p>\n<p>This is the <strong>B390 heat exchanger<\/strong>, which features an <strong>asymmetric plate design<\/strong> specifically designed for high-density AI and HPC data centers. With a cooling capacity of up to 2.000 kW and support for 4-inch high-flow connections, it easily manages the <strong>transient heat loads of next-generation high-power servers<\/strong>. Measuring only 321 mm in width and 751 mm in length, the B390 offers exceptional cooling performance in a compact footprint\u2014perfectly <strong>integrating into In-Row CDU systems<\/strong> while maximizing space efficiency.<\/p>\n<p><img decoding=\"async\" loading=\"lazy\" class=\"aligncenter wp-image-11111\" src=\"https:\/\/www.tempco.it\/blog\/wp-content\/uploads\/2026\/02\/Tempco-scambiatori-di-calore-B390-raffreddamento-a-liquido-data-center-HPC-1.jpg\" alt=\"\" width=\"435\" height=\"545\" srcset=\"https:\/\/www.tempco.it\/blog\/wp-content\/uploads\/2026\/02\/Tempco-scambiatori-di-calore-B390-raffreddamento-a-liquido-data-center-HPC-1.jpg 600w, https:\/\/www.tempco.it\/blog\/wp-content\/uploads\/2026\/02\/Tempco-scambiatori-di-calore-B390-raffreddamento-a-liquido-data-center-HPC-1-239x300.jpg 239w\" sizes=\"(max-width: 435px) 100vw, 435px\" \/><\/p>\n<p>Optimized for the pressure drop differences on both sides of In-Row CDU systems, the B390 ensures stable flow distribution and higher overall performance. It is <strong>available in single or multi-pass configurations<\/strong> and supports vertical, horizontal, or flat installations, providing flexible integration for various system and space requirements in data center environments.<\/p>\n<p>B390 continues the core advantages of Kaori&#8217;s B Series:<\/p>\n<ul>\n<li>Exclusive plate pattern design: maximizes heat transfer efficiency while maintaining low pressure drop.<\/li>\n<li>High working pressure construction: ensures long-term reliability for high-pressure liquid cooling systems.<\/li>\n<li>Compact design: pptimizes space utilization to meet high-density integration needs.<\/li>\n<\/ul>\n<p>A second interesting heat exchanger model, also developed specifically for next-generation, high-density data center environments in the AI \u200b\u200bera, is the <strong>K390<\/strong>. The same-sized K390 heat exchanger features a <strong>symmetrical plate design<\/strong>, ideal for balanced bidirectional flow systems.<\/p>\n<p><img decoding=\"async\" loading=\"lazy\" class=\"aligncenter wp-image-11113\" src=\"https:\/\/www.tempco.it\/blog\/wp-content\/uploads\/2026\/02\/Tempco-scambiatori-di-calore-B390-raffreddamento-a-liquido-data-center-HPC-AI-1.jpg\" alt=\"Image showing a front view of an innovative, high-efficiency heat exchanger for liquid cooling applications in modern, high-density data centers in the AI \u200b\u200band HPC era.\" width=\"435\" height=\"526\" srcset=\"https:\/\/www.tempco.it\/blog\/wp-content\/uploads\/2026\/02\/Tempco-scambiatori-di-calore-B390-raffreddamento-a-liquido-data-center-HPC-AI-1.jpg 600w, https:\/\/www.tempco.it\/blog\/wp-content\/uploads\/2026\/02\/Tempco-scambiatori-di-calore-B390-raffreddamento-a-liquido-data-center-HPC-AI-1-248x300.jpg 248w\" sizes=\"(max-width: 435px) 100vw, 435px\" \/><\/p>\n<p>Together, the <strong>B390 and K390 form a complementary solution<\/strong>, offering greater design flexibility and performance options for in-row liquid cooling architectures.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Two innovative, high-efficiency heat exchangers specifically designed with features that make them ideal for liquid cooling applications in modern high density AI and HPC data centers.<\/p>\n","protected":false},"author":5,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":[],"categories":[64,61,63,113,473,84],"tags":[3914,1723,3353,3907,4622,127,3570,4498,126,495,138,161,4097,4096,3535,1525,3020,1049,3938,1543,342,3930],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v20.5 - 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