{"id":10747,"date":"2025-10-03T12:27:04","date_gmt":"2025-10-03T10:27:04","guid":{"rendered":"https:\/\/www.tempco.it\/blog\/?p=10747"},"modified":"2025-10-03T12:27:04","modified_gmt":"2025-10-03T10:27:04","slug":"pche-heat-exchangers-for-the-energy-transition-market","status":"publish","type":"post","link":"https:\/\/www.tempco.it\/blog\/en\/10747\/pche-heat-exchangers-for-the-energy-transition-market\/","title":{"rendered":"PCHE heat exchangers for the energy transition market"},"content":{"rendered":"

MicroChannel Devices<\/strong>, Tempco’s partner for PCHE printed circuit heat exchangers<\/strong><\/a> projects, was a guest at the Venice Film Festival in early September, where CEO Alessandro Vaiarelli<\/strong> spoke about the company’s founding. In particular, Vaiarelli offered a virtuous example of sustainability storytelling<\/strong> at the event ‘Energy and digital transition towards smart and sustainable cities’.<\/p>\n

The green transition and energy efficiency<\/strong> are key themes underlying MicroChannel Devices’ technological offering, making the company an iconic example of the ongoing shift toward sustainable innovation paradigms for the future of everyone – companies, manufacturing, and communities.<\/p>\n

As CEO Alessandro Vaiarelli explains, MicroChannel Devices is an innovative SME founded in 2020 as a spin-off and evolution of the family business STV, leveraging the expertise and experience built over 60 years in the automotive and electronics sectors<\/strong>. Vaiarelli then lucidly illustrates how Italian companies can regenerate themselves by investing in innovation<\/strong>, which in the case of MicroChannel Devices meant specializing in the development and production of microchanneled devices<\/strong> that find their ideal application in the energy transition market.<\/p>\n

Specifically, thanks to the valuable synergy and collaboration with Tempco, the company produces PCHE exchangers<\/strong><\/a> (printed circuit heat exchangers) using innovative technologies such as diffusion bonding<\/strong><\/a>, or solid-state welding, which produces a heat transfer pack with extremely high structural strength, and a process called chemical etching<\/strong>, a photochemical etching technique similar to that used in electronics for chip production. This process in particular allows for the creation of heat transfer circuits with extremely high thermal transfer efficiency<\/strong>, with highly customized layouts and the possibility of building exchangers even in multi-stream mode<\/a>.<\/p>\n

The characteristics offered by these innovative plate heat exchangers make them the ideal technological solution for all new applications in the hydrogen supply chain<\/strong><\/a>, in nuclear energy<\/strong> with fourth-generation Small Modular Reactors<\/a>, as well as for cold plates in direct-to-chip liquid cooling<\/a> for data centers<\/strong> that will serve future artificial intelligence applications, as well as in the oil & gas and LNG sectors<\/strong><\/a>.<\/p>\n